Announced that Qualcomm during the events of the MWC conference today about the latest chipset communication core Qualcomm QCA6390 that support Wi-Fi 6 Bluetooth 5.1.
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Offering a Qualcomm chip Qualcomm QCA6390 that come with features to support higher performance in call Wi-Fi and Bluetooth, on laptops and smart phones.
As this is the slide the first slide accurately manufacture the 14-nanometer feature support for Wi-Fi 6 Bluetooth 5.1, and arrange a slice on the structure of the QCA6390 with MU-MIMO, to support connection to high-speed Wi-Fi 6 with the consumption of balanced energy, along with support for speed in call up to 1.8 GB per second, with support frequency 2.4 to 5 GHz.
Slice QCA6390 come improvements of 50% in energy consumption, as coming improvements in the technology of audio of the highest quality, with less delay in the audio, enhance the audio in the heavens represented by the younger, also supports the company’s navigation technology Qualcomm TrueWireless Stereo Plus, to support raise the quality of the acoustics with the consumption of less battery.
Slice QCA6390 supports up to 18 dB with Bluetooth, and Qualcomm began paying prototyping of partner QCA6390 development by some users.