Samsung officially confirmed its intention to release chip memory of UFS 3.0 in the next year


Samsung revealed today that it will unveil technology storage UFS 3.0 in the next year. The confirmation was made head of the Department storage solutions at Samsung, Mr. Jay Oh during the summit of the Qualcomm 4G/5G Summit which was held in Hong Kong. Said Samsung that cache UFS 3.0 will be available with different capacities include 128GB, 256GB and 512GB.

Said Micron, which is another company specialized in the manufacturing of memory chips to the first smartphones with 1 TB of memory storage will be by the year 2021. It is expected to become the first integrated chip storage with a capacity of 1 TB ready by that time.

Will the standard UFS 3.0 new a substantial increase on the level of performance. And the Samsung company that there will be an increase in data transfer rate of the memory by about twice compared to UFS 2.1, a standard storage currently used in mobile devices. This will be possible with keep the same dimensions so as not to be memory chips of the new larger.

Sure that the storage technology UFS 3.0 is required, especially with the approaching arrival of 5G in the next year. Thanks to technology calling the new service will be new hardware required to obtain solutions faster storage. Of course, it remains to be seen whether Samsung will include a memory chip based on technology UFS 3.0 in the Galaxy S10 which will be released probably in the first quarter of next year. It is expected that the company Samsung to launch a special version of the Galaxy S10 supports the 5G, so maybe we’ll see this version with the memory chip based on the technology of the UFS 3.0.


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