Samsung has announced about bringing improvements for the slides possible to accurately manufacture 7 nm, where the package of slats is now on the 3D technology process for the manufacture of EUV resists which support energy saving, while minimizing the space occupied by the processing unit.
Started the Korean giant is already in mass production for the slides possible to accurately manufacture 5 nm, which supports the new generation of phones of the company next year, which applies to entitled Galaxy S21 or Galaxy S30, with the concentration of Korean giant on the new generation of slides, however, Samsung officially confirmed to bring improvements for the slides possible to accurately manufacture 7 nm.
I know of
I have made sure Samsung to add improvements for the slides possible to accurately manufacture 7 nm through the use of 3D technology to collect the slides in the package using the process of manufacturing the EUV resists that focus on the accuracy of 7 nm, a technique known from the Samsung X-Cube.
This new technique in the pressure of the slides on the accumulation of the memory of the SRAM to the top of the next, by using the technique of Samsung’s TSV, which focuses on small holes to support the tie layers of the chips, a process different from the system of the semiconductor of the traditional.
Supports this new technology in the chip manufacturing process to accurately manufacture 7 nm, reducing the size of the chip, and also to save energy consumption in the processing unit, this coupled with the speed of data transfer.